- Stable synthesis technology for agglomerated particles in a stable ultra-high temperature atmosphere
- Technology to control shape and agglomerated particle size according to thickness
- Strict quality control and inspection technology
- Image analysis technology
- Ion analysis technology
- Particle characteristic measurement and analysis technology, etc.
Our unique manufacturing method aggregates h-BN to create a structure that eliminates weak points caused by anisotropy. Adding our filler to items such as sheets, adhesives, and greases achieves high thermal conductivity.
Our filler has outstanding filling properties for thermosetting resins such as epoxy resins. MF100 is increasingly being used as a thermal filler for thermal interface sheets or Insulated metal-resin Substrate materials, with thermal conductivity of 12 W/mK or higher.
JFE Mineral Technology Supporting Boron Nitride Fillers for Electronic Materials
Examples of Usage
BN Filler Loading Rate and Thermal Conductivity (W/mK) *Results of measurement by our company
Thermal conductivity of mass-produced thermal dissipation sheets (W/mK)
